FREMONT, Calif.--(BUSINESS WIRE)--Jul 7, 2025-- Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers. These systems will support advanced packaging processes for Edge Computing and HPC solutions, delivering critical low-temperature curing, annealing, and degassing for WLCSP, Plated Bump, and Cu Pillar applications. This press release features multimedia.